Semiconductor and Packaging

“THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS”

IP Approach is pleased to present the exclusive patent for sale “Thermal management of three-dimensional integrated circuits” which includes U.S. Granted Patent US 11,710,723 B2 and its application patents US 20230395570 A1, US 20230048534 A1, 63/229,826, 62/229,842 and 18/400,219 assigned to Kambix Innovations LLC. The IP relates to integrated circuits, thermal management of integrated circuits and three-dimensional (3D) integrated circuits.

The technology disclosed provides the following advantages:

The invention provides for the design and optimization of a composition heat spreader to improve the thermal management of a 3D integrated circuit.
The invention provides geometrical optimization of the inserts, embedded in a heat spreader, to improve its cooling performance for 3D integrated circuits.
The invention allows the generated heat, throughout device layers, to be transferred via conduction to a heat sink through a heat spreader.
The invention allows the size of the heat spreader and heat sink to be larger than other layers to extend the surface area exposed to the cooling fluid and to enhance the heat transfer to the ambient fluid.
The invention provides a high-conductivity material that can be used to boost the thermal conductance of the heat spreader to overcome the decreasing cooling capability of the heat spreader.

The global 3D IC market is estimated to grow from USD 8.0 billion in 2022 to USD 49.95 billion by 2032, at a Compound Annual Growth Rate (CAGR) of 20.1% during the forecast period.

Please contact Justin Ehrlickman via email at justin@ipapproach.com or phone at 845-558-7901 to receive a Brokerage Marketing Package.

“Systems and Methods for Providing Modulation of Switchmode RF Power Amplifiers”

IP Approach is pleased to present the attached exclusive patents for sale “Systems and methods for providing modulation of switchmode RF power amplifiers” which includes U.S. Granted Patents US 9,041,479 B2, US 9,425,741 B2 and US 9,614,478 B2 assigned to Stryker Corp. The IP relates generally to signal processing and more particularly to switchmode RF power amplifiers.

The technology disclosed provides the following advantages:

The invention is utilized in a variety of contexts like an amplifier connected to a transmitter antenna.
The invention amplifier/antenna combination can be deployed in a medical environment. The amplifier/antenna combination can be used for activating RFID circuits located within the medical environment.
The invention provides controlling the voltage difference between the output and the output of the low dropout regulator to maintain a minimum operating voltage difference (e.g., 0.5 volts) enables the system to maintain a high efficiency.

The RF Power Amplifier market is to grow from USD 5.2 Billion in 2022 and is expected to reach USD 20.67 Billion in 2032, growing at a compounded annual growth rate (CAGR) of 14.8% during the forecast period.

Please contact Justin Ehrlickman via email at justin@ipapproach.com or phone at 845-558-7901 to receive a Brokerage Marketing Package.

“Liquid Cooled Metal Core Printed Circuit Board”

IPApproach LLC is pleased to present the exclusive patents for license “Liquid cooled metal core printed circuit board” which includes U.S. Granted Patents US 9,686,887 B2 & CA 2,961,001 C assigned to Nicholas Michael D’Onofrio.

The IP relates to a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board.

The technology disclosed provides the following advantages:

The invention allows a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB.
The system minimizes thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.
The system increases thermal dissipation rates, higher possible input temperatures for cooling fluids, lower energy consumption, simplified production methods, and lower production costs.

Please contact Justin Ehrlickman via email at justin@ipapproach.com or phone at 845-558-7901 to receive a Brokerage Marketing Package.

"3-Dimensional Multi-Layered Modular Computer Architecture"

IPApproach LLC is pleased to present the exclusive patents for sale “3-Dimensional Multi-layered Modular Computer Architecture” which includes U.S. Granted Patents US 8,274,792 B2, US 9,164,555 B2, US 10,067,539 B2, and foreign counterparts EP 1,934,668 B1, CA 2,621,505 C assigned to Beyond Blades Ltd. The IP is intended for providing a computer architecture that significantly improves computer mass, volume and power densities through the use of 3-Dimensional layered structure instead of traditional 2-Dimensional Printed Circuit Board structure. The technology disclosed provides the following advantages:

- The invention provides a computer architecture that significantly improves computer mass, volume & power densities.
- Provides high density computing platforms.
- The invention provides a solution for increase in device volumetric and mass efficiency, cooling problems, standardization problems and higher costs.
- The invention solves the limitation of bus speed for longer, larger latencies, cross-talk between signals, increases in noise pickup, worsen signal shape due to parasitic capacitance and parasitic inductance and electromagnetic noise that affect other devices nearby.

Please contact Justin Ehrlickman via email at justin@ipapproach.com or phone at 845-558-7901 to receive a Brokerage Marketing Package.

"Rotary SIM Tray Holder and STEM Ejectable SIM Tray Holder Assembly"

IPApproach LLC is pleased to present the exclusive patents for sale “ROTARY SIM TRAY HOLDER AND STEM EJECTABLE SIM TRAY HOLDER ASSEMBLY” which includes U.S. Patents US 10078797 B1 and US 9886654 B1 assigned to Almora LLC. The IP relates to tray holders that hold SIM or MMC cards and ejectable component assembly that allows insertion as well as ejection of SIM or MMC cards which can be used in electronic devices such as smartphone, tablet, etc.

The technology disclosed provides the following advantages,

Stem ejectable component assembly allows insertion and ejection of tray holder without using pin or needle.
Tray holders provide convenience of putting one or more SIM or MMC cards within a device, or removing them without comprising to open the device cover.
Tray holder is configured to hold the SIM cards in active positions or standby positions so that the SIM cards may not have to be removed or inserted in the tray holder to change.
The handle grabber is configured to allow rotation of the tray holder to enable insertion of the rotary tray holder in an electronic device with any of two opposing faces of the tray holder oriented in a desired direction.

The target price for this portfolio is $200,000.

Please contact Justin Ehrlickman via email at justin@ipapproach.com or phone at 845-558-7901 to receive a Brokerage Marketing Package.